Marin Alexe,Ulrich Gosele: Wafer Bonding: Applications and Technology

Wafer Bonding: Applications and Technology



____________________________
Author: Marin Alexe,Ulrich Gosele
Number of Pages: 504 pages
Published Date: 30 Sep 2011
Publisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
Publication Country: Berlin, Germany
Language: English
ISBN: 9783642059155
Download Link: Click Here
____________________________